Peel Test of Plating Film on Resin Under Varied Temperature Environments

User Benefits

- The adhesion of plating under temperature environments from -60 ˚C to 250 ˚C can be measured by using the jig and thermostatic chamber introduced in this article. - It is possible to measure the adhesion of the plating as described in JIS H 8630, JIS C 6481.

Introduction

Parts produced by applying platings to the surface of resins are generally used in applications ranging from decorative parts in the automotive industry to electrical devices and the electrical and electronic/semiconductor fields. Since technologies for applying platings to hard-to-plate resins have also been required for the printed boards of automotive components and advanced electronic equipment in recent years, a wide-range of research and development projects are underway on topics including new resin materials, plating chemicals, and plating production processes. To ensure that plating films fully demonstrate their functions, films must secure adhesion without peeling under their intended use environments. At present, the main methods for evaluating the adhesion of plating are the thermal cycle test and the heat shock test, but these cannot be considered quantitative evaluation methods. This article introduces an example in which a peel test was conducted using a universal testing machine, and the adhesion of the plating under various temperature environments was quantified.

September 18, 2024 GMT