Hyper Vision HPV-X2 - Features

The Camera Can Be Used in Combination with Commercially Available Image Analysis Software

• High-speed phenomena can be subjected to image analysis and numerical analysis by saving the recorded images in a common format, and then loading them into commercially available image analysis software.
• In particular, to obtain strain distributions for samples during material tests, commercially available strain distribution analysis software can be used, which operates on the principle of digital image correlation (DIC).

 

3-D strain analysis of CFRP thin plate
The deformation behavior of a CFRP thin plate colliding with a steel ball emitted by a gas gun at supersonic speed h as been captured by two high-speed cameras. By using 3D-DIC software, it is possible to analyze a temporal change of the strain distribution in the direction perpendicular to the thin plate.
(Provided by the Tanabe Laboratory at Nagoya University)

Burst Method Enables Ultra High-Speed Recording

For typical high-speed video cameras, image storage memories are located outside of the image sensor. Because the number of signal output taps are overwhelmingly small compared to the number of pixels, the transfer of the video signals from the pixels to the memories must be a sequentially serial process; therefore, ultra high-speed recording of more than 1 million frames per second could not be realized. In contrast, Shimadzu's burst image sensor has the same number of built-in memories as number of frames recorded. Furthermore, a pixel and memories are connected by wire in a one-to-one manner in order to completely parallel transfer the video signal from the pixels to the memories. This makes it possible to realize ultra high-speed recording at 10 million frames per second. In addition, since it not limited to the number of signal output taps as with conventional serial transfer system, high-resolution recording at ultra high speed is available.

Next-Generation Burst Image Sensor Based on CMOS Technology

Conventional burst image sensors are based on CCD technology, in which the memory is positioned adjacent to the pixels. As a result, there are problems with decreased image quality due to signal leakage from pixels to memory. Accordingly, the Shimadzu FTCMOS burst image sensor adopts CMOS technology, in which the pixels and memory are spatially separated to achieve high image quality with no signal leaks.
In addition, with the FTCMOS2, light sensitivity is six times better than with FTCMOS, thanks to the adoption of a new CMOS process.
 

FP Mode and HP Mode

• The FTCMOS2 sensor has 100,000 pixels and a 12.8 million bit memory.
• In FP mode, each 128 bit memory element is assigned to 100,000 pixels.
• In HP mode, each 256 bit memory element is assigned to 50,000 pixels.
• The maximum recording speed in HP mode is 10 million frames/second, and the number of frames recorded is 256, twice the number in FP mode. However the resolution is 1/2, at 50,000 pixels.*