Film Deposition Technology
Increasing Added Value and Productivity for the Transition of Automotive Parts to Plastic
These systems ensure high-quality film properties and offer among the highest throughput rates available in the industry for automating operations inline with injection molding machines
Features
- High- throughput
(can be linked to injection molding machines) - High-adhesion
- High-coverage on three-dimensional parts
- Simple batch system
Applications
- ELTRATM (Electromagnetically transmittable film), millimeter wave transparent emblems, and Smart handle
- HUD (head-up display) mirrors
- Headlamp reflectors
- Dry base layer for plating plastics
- EMI shielding film
- Optical parts
- Ornamental parts
LiDAR Cover
As more and more in-vehicle sensors such as LiDAR are being installed for automatic driving, anti-reflection films are required for the parts that cover them to improve their sensing function.
Uniform optical characteristics can be obtained by depositing an anti-reflection film with good adhesiveness on a three-dimensional cover. Furthermore, by using a special plasma processing technology, highly adhesive films that can withstand automotive environments can be deposited at high speed.
Special plasma treatment on a 45° inclined surface + 2-layer deposition: Good optical properties in the infrared region
![](../common/img/film/img_lidar01.jpg)
![](../common/img/film/img_lidar02.jpg)
![](../common/img/film/img_lidar03.jpg)
High-speed Cu Electrode Deposition
There is an increasing need for micron-level Cu wiring on polycarbonate (PC) and other plastics for in-vehicle sensors and harnessless applications.
High-speed deposition makes it possible to deposit Cu electrodes at high speed, even on PC materials with low heat resistance.
Cu film thickness | Tact | Work temperature |
---|---|---|
Up to 2.0 µm | Up to 5 min. | Up to 110 °C |
Up to 1.0 µm | Up to 10 min. | Up to 120 °C |
Dry Seed Layer on Difficult-To-Plate Plastic
The special high-density plasma treatment and Cu sputter enable dry electroless plating layers possible. Patterning is easy and applicable to electrode formation on plastics such as MID*.
In addition to ABS, plating on difficult-to-plate materials (engineering plastics such as PBT, glass, etc.) is also possible.
*MID=Molded Interconnect Device=Plastic injection-molded product with electrical circuit wiring that has both mechanical and electrical functions
![](../common/img/film/img_dryseed.jpg)
Improving Automobile Design Characteristics and Comfort
Reflectance data of AI film for HUD Mirrors and Multilayer films for Reflector
![](../common/img/film/img_hud01.jpg)
![](../common/img/film/img_hud02.jpg)
![](../common/img/film/img_hud03.jpg)
- Able to process from single aluminum layer reflectance 90% to multilayer reflectance 97%.
- No significant reflectance variability within continuous batches of 1,700 units.
![UHSP-OP2060/UHSP-2040 Series](../common/img/film/img_uhsp.jpg)
Ultra High-Speed Sputtering Systems
UHSP-OP2060/UHSP-2040 Series
This film deposition system layers metal/metal-oxide films by sputtering and silicon-oxide films by chemical vapor deposition (CVD) onto three dimensional injection molded plastics including plasma pretreatment in an integrated vacuum chamber.
![UHSP-OP2060/UHSP-2040 Series](../common/img/film/img_uhsp.jpg)